BROCHURE
Michael Pecht is a Professor ,University of Maryland ,USA

Michael Pecht

Professor

Organizing Committee

USA

University of Maryland

BIOGRAPHY

Professor Michael Pecht is the founder of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year.

He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum.

He has written more than twenty books on electronic product development, use and supply chain management, and over 400 technical articles. 

He consults for 22 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP, and risk assessment of electronic products and systems.

PUBLICATIONS

S Saxena, L Kong, M Pecht. “Exploding E-Cigarettes: A Battery Safety Issue.” IEEE Access.

F Dalvand, M Kang, S Dalvand, M Pecht. “Detection of Generalized-Roughness and Single-Point Bearing Faults Using Linear Prediction-Based Current Noise Cancellation.”

Z Liu, Z Jia, C Vong, J Han, C Yan, M Pecht. “A Patent Analysis of Prognostics and Health Management (PHM) Innovations for Electrical Systems” IEEE Access

Y Zhang, R Xiong, H He, M Pecht. “Lithium-ion battery remaining useful life prediction with Box-Cox transformation and Monte Carlo simulation” IEEE Transactions on Industrial Electronics

Y. Zhang, R. Xiong, H. He, M. Pecht. “Long short-term memory recurrent neural network for remaining useful life prediction of lithium-ion batteries” IEEE Transactions on Vehicular Technology.

P. Motabar, H. Gonzalez, P. Rundle, M. Pecht. “How Poor Reliability Affects Warranties: An Analysis of General Motors' Power train Warranty Reduction.” IEEE Access.

W. Diao, J. Jiang, C. Zhang, H. Liang, M. Pecht. “Energy State of Health Estimation for Battery Packs Based on the Degradation and Inconsistency” Energy Procedia

Zhang, Zheng-Xin, Xiao-Sheng Si, Chang-Hua Hu, and Michael G. Pecht. "A Prognostic Model for Stochastic Degrading Systems with State Recovery: Application to Li-ion Batteries." IEEE Transactions on Reliability

A. Fortier, M. Tsao, N. Williard, L. Yinjiao Xing, and M. Pecht, ”Preliminary Study on Integration of Fiber Optic Bragg Grating Sensors in Li-Ion Batteries and In Situ Strain and Temperature Monitoring of Battery Cells. ”Energies

J.  Fan, M.  G.  Mohamed, C. Qian, X. Fan, G. Zhang, and M. Pecht. “Color Shift Failure Prediction for Phosphor-Converted White LEDs by Modeling Features of Spectral Power Distribution with a Nonlinear Filter” MDPI Materials

R. Xiong, Y. Zhang, H. He, X. Zhou, and M. Pecht. “A double-scale, particle-filtering, energy state prediction algorithm for lithium-ion batteries” IEEE Transactions on Industrial Electronics. 

L. Shu, M. Mukherjee, M. Pecht, N. Crespi, and S. N. Han.  ”Challenges and Research Issues of Data Management in IoT for Large-Scale Petrochemical Plants” IEEE Systems Journal

S.C. Huang, K.H. Tseng, J.W.Liang, C.L. Chang and M. Pecht. “An Online SOC and SOH Estimation Model for Lithium-Ion Batteries” Energies.

S. Saxena, G. Sanchez, and M. Pecht. “Batteries in Portable Electronic Devices: A User's Perspective.” IEEE Industrial Electronics Magazine.

F. Dalvand, S. Dalvand, F. Sharafi, and M. Pecht. “Current Noise Cancellation for Bearing Fault Diagnosis Using Time-Shifting.” IEEE Transactions on Industrial Electronics.

V. Arvind, and M. Pecht. "Electronic Circuit Health Estimation Through Kernel Learning. "IEEE Transactions on Industrial Electronics”.

Su, X., S. Wang, M. Pecht, L. Zhao, and Z. Ye. “Interacting Multiple Model Particle Filter for Prognostics of Lithium-ion Batteries,” Microelectronics Reliability.

Sun, Bo., Xiaopeng Jiang, Kam-Chuen Yung, Jiajie Fan, and M. Pecht. “A Review of Prognostic Techniques for High-Power White LEDs”. IEEE Transactions on Power Electronics.

Jameson, Jordan, M. Azarian, and M. Pecht, “Thermal Degradation of Polyimide Insulation and its Effect on Electromagnetic Coil Impedance,” Proceedings of MFPT 2017 Conference, Virginia Beach.

Li N. M., Das D., Pecht M., "Shelf Life Evaluation Method for Electronic and other Components using a Physics of Failure (PoF) Approach", Proceedings of MFPT 2017 Conference, Virginia Beach, VA.

Liu, Jiao, Myeongsu Kang, Jinfu Liu, Zhongqi Wang, Daren Yu, M. Pecht. A Comparative Study on Anomaly Detection of the Combustion System in Gas Turbine, Proceedings of MFPT 2017 Conference, Virginia Beach, VA.

J. Li, L. Wang, C. Lyu, M. Pecht. “State Of Charge Estimation Based On A Simplified Electrochemical Model For A Single Licoo2 Battery And Battery Pack.” Energy.

Shah, Rushit, M. Azarian, M. Pecht, “Fault Detection in Bearings Using Autocorrelation”. Proceedings of MFPT 2017, Virginia Beach, VA.

X. Cheng, L. Yao, M. Pecht. “Lithium-ion battery state-of-charge estimation based on the deconstructed equivalent circuit at different open-circuit voltage relaxation times.” Journal of Zhejiang University-Science.

Pandian,  Guru,  Diganta  Das,  M.  Osterman,  and  M.  Pecht,  Risk Assessment transition to Lead-free Electronics Assembly, Proceedings of MFPT 2017, Virginia Beach, VA.

Chang, Moon-Hwan, Myeongsu Kang, and M. Pecht. "Prognostics-Based LED Qualification Using Similarity-Based Statistical Measure With RVM Regression Model."  IEEE Transactions on Industrial Electronics.

Cheng, X.-M., L.-G. Yao, and M. Pecht, “Lithium-ion Battery State-of-Charge Estimation Based on Deconstructed Equivalent Circuit at Different Open-Circuit Voltage Relaxation Times,” Journal of Zhejiang University: Science A.

Yang, Q., R. Bi, K. Yung, and M. Pecht, "Electrochemically Reduced Graphene Oxides/Nanostructured Iron Oxides as Binder-free Electrodes for Supercapacitors", Electrochimica Acta.

Shrivastava, A.M. H. Azarian, and M. Pecht, "Failure of Polymer Aluminum Electrolytic Capacitors Under Elevated Temperature Humidity Environments". IEEE Transactions on Components, Packaging and Manufacturing Technology.

Liu, Z., T. Liu, J. Han, S. Bu, X. Tang and M. Pecht, "Signal Model-Based Fault Coding for Diagnostics and Prognostics of Analog Electronic Circuits", IEEE Transactions on Industrial Electronics.

W. Diao, N.Xue, V. Bhattacharjee, J. Jiang, O. Karabasoglu, M. Pecht. “Active battery cell equalization based on residual available energy maximization.” Applied Energy.

T. Formica, H. Khan, and M. Pecht. “The Effect of Inverter Failures on the Return on Investment of Solar Photovoltaic Systems.” IEEE Access.

M. Kang, M. Zhao, B. Tang, and M. Pecht, “Deep Residual Networks with Dynamically Weighted Wavelet Coefficients  for  Fault  Diagnosis  of  Planetary  Gearboxes.”  IEEE Transactions on Industrial  Electronics.

M. Pecht, S. Mathew, L. Gullo, J. Jameson, A. Vasan. “IEEE Standard Framework for Prognostics and Health Management of Electronic systems.” IEEE Standard Framework for Prognostics and Health Management of Electronic. Systems Print.

A. Vasan, A. Kleyner, and M. Pecht. “A New Application for Failure Prognostics – Reduction of Automotive Electronics Reliability Test Duration.” Annual Conference Of The Prognostics And Health Management Society.

B. Cornelius, S. Treivish, Y. Rosenthal, M. Pecht. “The Phenomenon Of Tin Pest: A Review.” Microelectronics Reliability.

G. Pandian, D. Das, Chuan Li, E. Zio, M. Pecht. “A critique of reliability prediction techniques for avionics applications.” Chinese Journal of Aeronautics, 2017.

M. Kohani. M. Pecht. “Malfunctions Of Medical Devices Due To Electrostatic Occurrences: An Analysis Of 10 Years Of FDA's Reports.” IEEE Access, 2017.

X. Cheng, M. Pecht. “In Situ Measurements Of Stresses On Li-Ion Battery Electrodes: A Review.” Energies.

Cripps E., and M. Pecht, "A Bayesian Nonlinear Random Effects Model for Identification of Defective Batteries From Lot Samples", Journal of Power Sources.

Jameson, N., M. Azarian and M. Pecht, "Impedance-Based Condition Monitoring for Insulation Systems Used in Low-Voltage Electromagnetic Coils", IEEE Transactions on Industrial Electronics.

Liu, Z., G. Sun, S. Bu, J. Han, X. Tang and M. Pecht, "Particle Learning Framework for Estimating the Remaining Useful Life of Lithium-Ion Batteries", IEEE Transactions on Instrumentation and Measurement.

Chang, M., M. Kang, and M. Pecht, "Prognostics-Based LED Qualification Using Similarity-Based Statistical Measure with RVM Regression Model", IEEE Transactions on Industrial Electronics.

Shrivastava, A., M. Azarian and  M. Pecht, "Failure of Polymer Aluminum Electrolytic Capacitors Under Elevated Temperature Humidity Environments", IEEE Transactions on Components, Packaging and Manufacturing Technology.

S. Padmanabhan, M. Pecht. “An isolated/non-isolated novel multilevel inverter configuration for a dual three-phase   symmetrical/asymmetrical   star-winding   converter.”   Engineering Science and Technology,   an International Journal.

P.  Sanjeevikumar,  S.  Mahajan,  F.  Blaabjerg,  M.  Pecht,  L.  Martirano,  M.  Manganelli,  “Dual  Six-Phase Multilevel AC Drive with Single Carrier Optimized Five-Level PWM for Star-Winding Configuration”, Lecture Notes in Electrical Engineering, Springer Journal Publications.

P. Sanjeevikumar, S. Mahajan, P. Dhond, F. Blaabjerg, M. Pecht, “Non-Isolated Sextuple Output Hybrid Triad Converter Configurations for  High Step-Up Renewable Energy Applications”, Lecture Notes in Electrical Engineering, Springer Journal Publications.

T.  Formica,  and  M.  Pecht,  "Return on Investment Analysis and Simulation of a 9.12kW  (kW)  Solar Photovoltaic System", Solar Energy.

Fortier, A., and M. Pecht, "A Perspective of the IPC Report on Lead-free Electronics in Military/Aerospace Applications", Microelectronics Reliability.

Venkitusamy, K., S. Padmanaban, M. Pecht, A. Awasthi, and R. Selvamuthukumaran, "A Modified Boost Rectifier for Elimination of Circulating Current in Power Factor Correction Applications", Microelectronics Reliability.

D. Kwon, M. Hodkiewicz, J. Fan, T. Shibutani, M. Pecht. “IoT-Based Prognostics and Systems Health Management for    Industrial    Applications.”     IEEE    Access.   

Yung, Kam-Chuen, Qin Yang, Jiajie Fan, M. Pecht. "Study of Electrochemical Performance of Li-ion Batteries based      on      Simultaneous     Measurement     of      a      Three-electrode     System." 2016 3rd Asia Pacific World Congress on Computer Science and Engineering (APWC on CSE).

Padmanaban, S.,  and M.  Pecht, "An Isolated/Non-Isolated Novel Multilevel Inverter Configuration for a Dual Three-Phase Symmetrical/Asymmetrical Star-Winding Converter", Engineering Science and Technology.

Cheng, X., L. Yao, Y. Xing, and M. Pecht, "Novel Parametric Circuit Modeling for Li-Ion Batteries", Energies.

Sun, B., X. Jiang, K. Yung, J. Fan, and M. Pecht, "A Review of Prognostic Techniques for High-Power White LEDs", IEEE Transactions on Power Electronics

Pecht, M., T. Shibutani, and L. Wu, "A Reliability Assessment Guide for the Transition Planning to Lead-Free Electronics for Companies Whose Products Are RoHS Exempted or Excluded", Microelectronics Reliability.

Mukherjee, S., P. Chauhan, M. Osterman, A. Dasgupta, and M. Pecht, "Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints", Journal of Electronic Materials.

Zheng, F., Y. Xing, J. Jiang, B. Sun, J. Kim, and M. Pecht, "Influence of Different Open Circuit Voltage Tests on State of Charge Online Estimation for Lithium-Ion Batteries", Applied Energy.

Pearl, A., M. Osterman, and M. Pecht, “Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading”, Journal of Electronic Materials.

George, E., and M. Pecht, "RoHS Compliance in Safety and Reliability Critical Electronics," Microelectronics Reliability.

Kirillov, S., A. Kirillov, V. Iakimkin, A. Khodos, and M. Pecht, "PHM Applications in Medicine and Medical Implantable Devices", 2016 IEEE PHM Conference, Chengdu, China.

X. Cheng, L. Yao, M. Pecht, Y. Xing. “Novel Parametric Circuit Modeling for Li-Ion Batteries.” Energies.

Mohammed,  A.,  and  M. Pecht.  "A  Stretchable  And  Screen-Printable  Conductive  Ink  For  Stretchable Electronics." Applied Physics Letters.

Zheng F,  J.  Jiang, B.  Sun, W. Zhang, and  M. Pecht, 2016, “Temperature-Dependent Power Capability Estimation of Lithium-ion Batteries for Hybrid Electric Vehicles”, Energy.

Pecht,  M.,  T.  Shibutani,  and  M.  Kang,  M.  Hodkiewicz,  and  E.  Cripps,  “A  Fusion  Prognostics-based Qualification Test Methodology for Microelectronic Products”, Microelectronics Reliability.

Woo, S., and Pecht, M., "Reliability Design of Residential-Sized Refrigerators Subjected to Repetitive Random Vibration Loads during Transportation", Athens: ATINER'S Conference Paper Series.

M. Kang, J. Kim, I. K. Jeong, J. M. Kim, and M. Pecht, "A Massively Parallel Approach to Real-Time Bearing Fault Detection Using Sub-Band Analysis on an FPGA-Based Multicore System," in IEEE Transactions on Industrial Electronics.

Saxena, S., C. Hendricks, M. Pecht, “Cycle Life Testing and Modeling of Graphite/LiCoO2 Cells under Different State of Charge Ranges”, Journal of Power Sources, Elsevier.

Kang, M., G. R. Ramaswami, M. Hodkiewicz, E. Cripps,   J. Kim, and M. Pecht, “A Sequential k-Nearest Neighbor Classification Approach for Data-Driven Fault Diagnosis Using Distance- and Density-Based Affinity Measures”, Springer International Publishing Switzerland.

Pandian, G. P., G. K. Ramaswami, M. Hodkiewicz, E. Cripps, and M. Pecht, “Long-term Reliability of Lead- free Electronic Systems,” 23rd International  Symposium on The Physical and Failure Analysis of Integrated Circuits, Singapore.

Manoharan, S., G. K. Ramaswami, F. P. McCluskey, and M. Pecht, “Failure Mechanism in Encapsulated Copper  Wire-Bonded  Devices,”  23rd International  Symposium on the Physical  And  Failure Analysis of Integrated Circuits, Singapore.

Li,  N.,  X.  Yu,  and  M.  Pecht,  “Position and Enforcement Practice of the  People's Republic of China's Pharmaceutical  Data  Exclusivity  Protection”, Drug  Design, Development and Therapy, Dove press.

Jameson, N. J., K. Wang, C. Morillo, M. H. Azarian, and M. Pecht, “Health Monitoring of Solenoid Valve Electromagnetic Coil Insulation under Thermal Deterioration,” Proceedings of MFPT 2016/ISA's  62nd IIS, Dayton, OH.

Williard, N.,  C.  Hendricks, B.  Sood,  J.  S.  Chung, and  M.  Pecht,  “Evaluation of  Batteries for  Safe  Air Transport,” Energies.

Wong, E. H., W. D. van Driel, A. Dasgupta, and M. Pecht, “Creep Fatigue Models of Solder Joints: A Critical Review,” Microelectronics Reliability.

Kang, M, J.-M. Kim, R. Peng, X. Ma, M. Pecht, " DWPT-Based Sub-Band Analysis for Fault Detection of Rolling Element Bearings ", Scientific Journal of Information Engineering.

Yoon, J. R., E. Baek, H.-K. Kim, M. Pecht, and S. H. Lee, “Critical Dual Roles of Carbon Coating in H2Ti12O25 for Cylindrical Hybrid Supercapacitors,” in Carbon, Elsevier Press.

Kang, M., R. Islam, J. Kim, J. Kim, and M. Pecht, "A Hybrid Feature Selection Scheme for Reducing Diagnostic Performance Deterioration Caused by Outliers in Data-Driven Diagnostics,” IEEE Transactions on Industrial Electronics.

Tian, J., C. Morillo, M. H. Azarian, and M. Pecht, “Motor Bearing Fault Detection Using Spectral Kurtosis- based Feature Extraction Coupled with k-Nearest Neighbor Distance Analysis,” IEEE Trans. Ind. Electron.

Lee, J.-H., H.-K. Kim, E. Baek, M. Pecht, S.-H. Lee, and Y.-H.  Lee, “Improved Performance of Cylindrical Hybrid Supercapacitor using Activated  Carbon/  Niobium  Doped  Hydrogen  Titanate,” Journal of Power Sources.

Wan, Y., H. Huang, D. Das, and M. Pecht, “Thermal Reliability Prediction and Analysis for High-density Electronic Systems Based on the Markov Process,” Microelectronics Reliability.

Pearl, A., M. Osterman, and M. Pecht, “Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading,” Journal of Electronic Materials.

Charbaji, A.,  M. Osterman, and M. Pecht, “Influence of Varying H2S Concentrations and Humidity Levels on ImAg and OSP Surface Finishes,” International Journal of Mechanical Engineering and Technology.

M. Kohani and M. Pecht, “New Minimum Relative Humidity Requirements Are Expected to Lead to More Medical Device Failures,” J. Medical Systems.

Ning, Y., M. Azarian, and M. Pecht, “Effects of Voiding on Thermo-mechanical Reliability of Copper-filled Micro vias: Modeling and Simulation,” IEEE Transactions on Device and Materials Reliability.

Williard, N., D. Baek, J. Park, B. Choi, M. Osterman, and M. Pecht, “A Life Model for Supercapacitors,” IEEE Transactions on Device and Materials Reliability.

Tessa, L.L., B.  P. Sood and M. G. Pecht, "Field Reliability Estimation for  Cochlear Implants," in IEEE Transactions on Biomedical Engineering.

Fan, J., C. Qian, K.-C. Yung; X. Fan, G. Zhang, and M. Pecht, “Optimal Design of Life Testing for High Brightness White LEDs Using the Six Sigma DMAIC Approach,” IEEE Transactions on Device and Materials Reliability.

Fan, J., C. Qian, X. Fan, G. Zhang, and M. Pecht, “In-situ Monitoring and Anomaly Detection for LED Packages Using a  Mahalanobis Distance Approach,” First  International  Conference on Reliability System Engineering  &  Prognostics  and  System Health  Management  Conference-Beijing  (2015  ICRSE  &  PHM- Beijing), Beijing, China.

Hendricks, Chris, N. Williard, S. Mathew, M. Pecht, A Failure Modes, Mechanisms, and Effects Analysis (FMMEA) of Lithium-ion Batteries, Journal of Power Sources.

Jameson, N., X. Song, and M. Pecht, N, “Conflict Minerals in Electronic Systems: An Overview and Critique of Legal Initiatives,” Science Engineering Ethics.

Oh,  H.,  S.  Choi,  K.  Kim,  B.  D.  Youn,  and  M.  Pecht,  “An  Empirical Model to Describe  Performance Degradation for Warranty Abuse Detection in Portable Electronics,” Reliability Engineering & System Safety.

Wang, K., J. Tian, M. Pecht, and A. Xu, “A Prognostics and Health Management Method for Instrumentation System Remanufacturing,” 2015 IEEE Conference on Technologies for Sustainability, Ogden, UT, USA.

Leng, F., C. M. Tan, and M. Pecht, “Effect of Temperature on the Aging Rate of Li-Ion Battery Operating Above Room Temperature,” Scientific Reports, Nature.

Wan, Y., H. Huang, and M. Pecht, “Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages,” IEEE Transactions on Device and Materials Reliability.

Menon, S., X. Jin, T. W. S. Chow, and M. Pecht, “Evaluating Covariance in Prognostic and System Health Management Applications,” Mechanical Systems and Signal Processing.

Menon, S., E. George, M. Osterman, and M. Pecht, “High Lead (Over 85 %) Solder in the Electronics Industry: RoHS Exemptions and Alternatives,” Journal of Materials Science: Materials in Electronics.

Patil,   N.,   D.   Das,   and   M.   Pecht,   “Anomaly Detection for IGBTs   Using   Mahalanobis  Distance,” Microelectronics Reliability.

Ma, P., S. Wang, L. Zhao, M. Pecht, X. Su, and Z. Ye, “An Improved Exponential Model for Predicting the Remaining Useful Life of Lithium-ion Batteries,” IEEE Conference on Prognostics and Health Management (PHM).

Guo, J., Z. Li, and M. Pecht, “A Bayesian Approach for Li-ion Battery Capacity Fade Modeling and Cycles to Failure Prognostics,” Journal of Power Sources.

EDUCATION

Ph.D. Engineering Mechanics (1982); M.S. Engineering Mechanics (1979); M.S. Electrical Engineering (1978); B.S. Acoustics-Physics (1976); Univ. of Wisconsin, Madison.

RESEARCH INTEREST

Competitive product development Product characterization and qualification Supply chain creation and management Prognostics and health management Product reliability, risk assessment and mitigation

HONORS AND AWARDS

The most highly cited article in Microelectronics Reliability for the years 2012, 2013, 2014, 2015, 2016: Chang, M.H., D. Das, P.V. Varde and  M. Pecht,  “Light  Emitting  Diodes  Reliability  Review,”  Microelectronics Reliability, Vol. 52, No. 5, pp. 762–782, May 2012.

Awarded: IEEE CPMT Technical Field Award (2016)

Awarded: 2015 Applied Energy Award – most highly cited research paper. Xing, Y., W. He, and M. Pecht, “State of Charge Estimation of Lithium-ion Batteries Using the Open-circuit Voltage at Various Ambient Temperatures,” Applied Energy, Vol. 113, pp. 106–115, Jan. 2014.

Best Student Paper Award of Conference (2016): N. Jordan Jameson, Kai Wang, Carlos Morillo, Michael H. Azarian, and Michael Pecht, “Health Monitoring of Solenoid Valve Electromagnetic Coil Insulation under Thermal Deterioration,” Proceedings of MFPT 2016/ISA's 62nd IIS, Dayton, OH, May 24-26, 2016.

Awarded: 2016 Chinese Academy of Sciences President's International Fellowship

Best paper award: Fan, J., ChengQian, Fan, X., Zhang, G., and M. Pecht, “In-situ Monitoring and Anomaly Detection for LED Packages Using a Mahalanobis Distance Approach,” The First  International  Conference on Reliability System Engineering & Prognostics  and  System Health  Management Conference-Beijing  (2015 ICRSE & PHM- Beijing), Beijing, China, October 23, 2015.

Awarded the distinction of “Honorary Professor” by the Harbin Institute of Technology (HIT) in Harbin, China, on July 16, 2015. The Honorary Professor award was granted to Prof Pecht for his technical expertise batteries and for his involvement with HIT in battery research. HIT was established in 1954 and is a member of the prestigious C9 League of Chinese universities. HIT was ranked 10th in the ranking of “Best Global Universities for Engineering” by U.S. News & World Report in 2015.

Awarded: 2015 Distinguished Scientist: Chinese Academy of Sciences President’s International Fellowship.

IEEE Access was awarded the 2015 PROSE Award winner in the subject category of “Journal/Best New STM (Scientific, Technical, and Medical).”  Prof. Pecht is the Editor-in-Chief of IEEE Access. The American Publishers Award for Professional and Scholarly Excellence (PROSE) annually recognizes the very best in professional and scholarly publishing by bringing attention to distinguished books, journals, and electronic content. IEEE Access was also a finalist for the Award for Excellence in Physical Sciences and Mathematics.

“Academic Excellence Award” by the Electronics Components Industry Association (ECIA). The award is used to recognize outstanding academic projects ‘that reference the application of advanced technologies for passive electronic components’. Peter, Anto, Michael H. Azarian, Michael Pecht, “Step Stress Testing of Electric Double Layer Capacitors,” International Capacitor and Resistor Technology Symposium, Santa Clara, CA, April 2014.

2014 Corporate Connector of the Year from the University of Maryland, College Park: The Corporate Connector Award celebrates those individuals or units on campus that do the most to promote and connect UM with the private sector to advance research, partnerships, and scholarship.

4th  most cited article   in Transactions of the Institute of Measurement and Control over five years (2009 -2014): Pecht, M. and Gu, J., “Physics-of-failure-based Prognostics for Electronic Products,” Trans. of the Institute of Measurement and Control, Vol. 31, No. 3/4, pp. 309–322, 2009, DOI: 10.1177/0142331208092031

2013: Received gift of $750k for research into automotive reliability from Hagans, Berman, Sobol, Shapiro LLP

2013  IEEE  Educational  Activities  Board/Standards  Association  (EAB/SA)  Standards  Education  Award  “for continued leadership in developing and promoting standards education in the field of reliability engineering.”

Outstanding Paper Award (2013): for Williard, N., W. He, M. Osterman, and M. Pecht, “Reliability and Failure Analysis of Lithium-Ion Batteries for Electronic Systems,” International Conference on Electronic Packaging Technology and High-Density Packaging (ICEPT-HDP), Aug. 2012.

University of Wisconsin-Madison College of Engineering Distinguished Achievement Award (2013). In recognition of the eminent Professional contributions as a “world-renowned professional engineer and educator whose innovations in reliability and prognostic methods have made a significant contribution to the field of electronics”

Most downloaded article in Microelectronics Reliability for the years 2012, 2013, 2014: Chang, M-H, D. Das, P.V. Varde, and M. Pecht, “Light Emitting Diodes Reliability Review,” Microelectronics Reliability, Vol. 52, No. 5, pp.762–782, May 2012.

First  Place,  IEEE  PHM  2012  Prognostic  Challenge,  Academic Category (2012): for successfully extracting degradation features from vibration data and developing fault propagation models to accurately predict the remaining useful life of bearings. The CALCE team included Arvind Vasan, Edwin Sutrisno, Wei He, Moon-Hwan Chang, Jing Tian, Yan Ning, Hyunseok Oh, and Surya Kunche.

Best Student Paper Award of Conference (2012): for Chauhan, P., M. Osterman, and M. Pecht, “Canary Approach for Monitoring BGA Interconnect Reliability under Temperature Cycling,” MFPT 2012: The Prognostics and Health Management Solutions Conference, Dayton, OH, April 24–26, 2012.

Overall Best Conference Paper from Academia (2011): for Haddad, G., P. Sandborn, and M. Pecht, “Method for Valuating Options Arising in PHM,” Proc. of 2011 IEEE PHM Conference, Denver, CO, June 2011.

Inducted to 2011 Innovation Hall of Fame at the A. James Clark School of Engineering, University of Maryland (2011): for pioneering innovations in advanced reliability and prognostic methods for electronics.

Maurice Simpson Technical Editors Award for best paper of the 2010 year (2010): for Gu, J. and M. Pecht, “Prognostics and Health Assessment Implementation for Electronic Products,” J. of the IEST, Vol. 53, Num 1, pp.44-58, April 2010.

Indian Society of Reliability, Maintainability and Safety Lifetime Reliability Achievement Award (2010): On Dec.16, 2010 in Mumbai, India, Dr. Pecht received the first and highest reliability award of its kind of India for his “significant contributions in the area of product reliability, prognostics & health management of electronic components.”

CPMT  Society  Exceptional  Technical  Achievement  Award  (2010):  to recognize exceptional technical achievement in the fields encompassed by the CPMT Society. “Dr. Pecht is recognized worldwide for his seminal contributions in the area of electronics reliability from which he has developed a new and significant field of prognostics for electronics. This includes models that enable in-situ assessment of the deviation or degradation of a product from expected normal operating conditions and the prediction of the future state of reliability of that product. Michael’s contributions in this area span more than 20 years and his subject matter expertise is disseminated in a book, several book chapters, handbooks, numerous articles, invited talks and short courses presented worldwide.”

Society of Automotive Engineering (SAE) Fellow (2010): for his research and promotion of the reliability of the electronic parts and systems used in automotive and aerospace applications.

National Defense Industrial Association award (2009) for CALCE for demonstrating outstanding achievement in the practical application of Systems Engineering principles, promotion of robust systems engineering principles throughout the organization, and effective systems engineering process development.

University of  Maryland  Outstanding Faculty Research  Award  (2009): to recognize research contributions and exceptionally influential research accomplishments by engineering faculty.

Outstanding Paper, I-Connect (Connecting the Global Electronics Supply Chain), (2009): for the paper, He, X., M. Azarian, and M. Pecht, “Comparative Assessment of Electrochemical Migration on PCBs with Lead-Free and Tin- Lead Solders,” SMT Online Magazine.

The Alexander Schwarzkopf Prize for Technological Innovation (2008): awarded to National Science Foundation (NSF) Industry/University Cooperative Research Centers that have had a significant impact on the world. CALCE won the award for its research on physics-of-failure reliability analysis methods and advanced supply chain management concepts for electronic products and systems.

Best Paper Award (2008): for the 62nd Meeting of the Society for Machinery Failure Prevention Technology. Gu, J., Barker D., and M. Pecht, “Prognostics of Electronics under Vibration Using Acceleration Sensors,” Proceeding for 62nd Meeting of the Society for Machinery Failure Prevention Technology (MFPT), Virginia Beach, VA, May 2008, pp. 253-263.

Maurice Simpson Technical Editors Award (2008) for best 2007 article in IEST. Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee, and Joseph Clayton, for their paper, “Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads,” Journal of the IEST, Vol. 50, No. 1, pp. 86–97, April 2007.

Japan Society for the Promotion of Science Fellowship (2008): for research in prognostics in electronics.

IEEE Reliability Society’s Lifetime Achievement Award (2007): recognizes Prof. Pecht’s long-term contributions to the Reliability Society, reliability research, and reliability education, all benefiting the reliability community.

European Micro and Nano-Reliability Award (2007): for outstanding contributions to reliability research.

Distinguished International Service Award (2006) for significant contributions to the development of international institutional programs at the University of Maryland; and distinguished international career.

Grand Fellowship of the Mirce Academy, England (2005): the highest award that the Academy can bestow upon an individual in recognition of their unique contribution to the understanding and/or predicting of the motion of functionality through system life, at the global level of significance.

IEEE Best Paper of the Year (2004) Award: for the paper titled “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages.”

The Royal Society, United Kingdom, Kan Tong Po Electrical Engineering Visiting Professorship Award at City University in Hong Kong (2002).

George E. Dieter Chair Professor of Mechanical Engineering, for significant contributions to the reputation of the Department, College and University with the establishment of CALCE Electronic Products and Systems Center (2001).

IEEE Standards Award for chairing and developing IEEE Standard Methodology for Reliability Prediction and Assessment for Electronic Systems and Equipment #1413 (2000).

IEEE Standards Award for chairing and developing IEEE Reliability Program Standard #1332 (2000).

3M Research Award for “research work in the electronics reliability area that has made significant contributions to the scientific understanding of material properties and their complex behavior” (1999).

ASME Electrical and Electronic Packaging Division (EEPD) Award “for outstanding contributions to the field of application of engineering mechanics to electronic packaging” (1999).

IEEE Undergraduate Teaching Award, “for the development and realization of a cross-disciplinary educational program in Computer-Aided Life Cycle Engineering (CALCE)” (1999).

The outstanding paper of the year for the Microelectronics Int’l Journal, “Popcorning in PBGA Packages during IR Reflow Soldering,” P. McCluskey, R. Munamarty, and M. Pecht, Vol. 42 Nr. 1, (1997).

ISHM/IEPS William D. Ashman Memorial Achievement Award (1997), “for his numerous contributions to academia and the electronics packaging industry.”

IEEE Reliability Society’s Annual Reliability Award (1996), “for his contributions to the IEEE Trans. on Reliability, his work with CALCE Electronic Packaging Research Center and his work on Reliability Standards.”

Faculty Achievement Award (April 1996), “in recognition of outstanding contributions to industrial research enabled by the Technology Initiatives Program.”

American Society for Quality Control: Reliability Division, Austin Bonis Award for the Advancement of Reliability Education (1996) for outstanding achievement in the advancement of reliability education.

Institute of Environmental Sciences Reliability Test and Evaluation Award (1996), “for vital contribution to the development and promotion of physics-of-failure modeling and analysis as a valuable reliability design and test process in the government, commercial and academic communities.”

ASME Fellow (1995), “for promoting the art, science, and practice of mechanical engineering.”

National Aeronautics Space Agency (NASA) certificate of “recognition of your significant contributions in the preparation and execution of the successful Second U.S. Microgravity Payload (USMP-2) Mission, launched on March 4, 1994.”

IEEE Fellow (1992), “for effectiveness in leadership in the development and realization of an exemplary program and successful efforts to raise the level of engineering excellence and practice within and without the organization.”

Int’l Electronic Packaging Society (IEPS) Educational Award “for excellence in  research and education at the University of Maryland CALCE Electronic Packaging Research Center (1990).”

Best paper of the year (Maurice Simpson Technical Editors Award) for the Journal of the Institute of Environmental Sciences, “Reliability Prediction of Electronic Packages,” May/June 1990.

The best paper award, “How Failure Prediction Methodology Affects Electronic Equipment Design,” with C. Leonard, Power Conversion Conf., Long Beach, CA, Oct. 16–19, 1989. Westinghouse Professor (1987-1988).

Visiting Scholar Award, Excellence in Reliability and Maintainability, Air Force Institute of Technology, Wright Patterson Air Force Base, Dayton, OH, June 15–July 10, 1987.

Outstanding Systems Engineering Faculty, (1986–1987), Systems Research Center, Univ. of Maryland.

The Engineering Research Center’s University of Maryland, Technology Advancement Program (TAP) Award (1986).

EDITORSHIP

Editor in Chief:

IEEE Access (2012–present): first editor of the journal; 2015 PROSE Award winner in the subject category of “Journal/Best New STM (Scientific, Technical, and Medical).” : Selected for Thomson Reuters Science Citation Index in 2015.

Life Cycle Reliability and Safety Engineering, Springer (2012–present)

Microelectronics Reliability, Elsevier (1996–2012)

International Journal of Performability Engineering (2009–2012)

IEEE Transactions on Reliability (1988–1997)

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